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An 8×64 pixel dot matrix microdisplay in 0.35-μm complementary metal-oxide semiconductor technology

机译:采用0.35μm互补金属氧化物半导体技术的8×64像素点阵微显示器

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摘要

Microdisplay technologies for near-to-eye applications mostlyuse a complementary metal-oxide semiconductor (CMOS) processingchip as backplane for pixel addressing, with extensive post-processingon top of the CMOS chip to deposit organic LED or liquid crystal layers.Here, we examine the possibility of integrating emissive microdisplayswithin the CMOS chip, with absolutely no post processing needed. Thiswill dramatically reduce the manufacturing cost of microdisplays andmay lead to new microdisplay applications. Visible electroluminescenceis achieved by biasing pn junctions into avalanche breakdown mode.The most appropriate CMOS pn junction is selected and innovative techniquesare applied to increase the light extraction efficiency from theCMOS chip using the metal layers of the CMOS process. An 8 × 64 dotmatrix microdisplay was designed and manufactured in a 0.35-μm CMOStechnology. The experimental results show that a luminance levelof 20 cd∕m2 can be reached, which is an adequate luminance value inorder to comfortably read data being displayed in relatively dark environments.The electrical power dissipation per pixel being activated is0.9 mW∕pixel. It is also shown that the pixels can be switched at a ratefaster than 350 MHz.
机译:适用于近眼应用的微显示技术主要使用互补金属氧化物半导体(CMOS)处理芯片作为像素寻址的背板,并在CMOS芯片顶部进行广泛的后处理,以沉积有机LED或液晶层。在CMOS芯片中集成发光微显示器的可能性,而绝对不需要后处理。这将大大降低微型显示器的制造成本,并可能导致新的微型显示器应用。通过将pn结偏置到雪崩击穿模式来实现可见电致发光。选择最合适的CMOS pn结,并应用创新技术来增加使用CMOS工艺的金属层从CMOS芯片中提取光的效率。采用0.35-μmCMOS技术设计和制造了8×64点矩阵微型显示器。实验结果表明,可以达到20 cd / m2的亮度水平,这是一个足够的亮度值,以便在相对较暗的环境中舒适地读取正在显示的数据。被激活的每个像素的电耗为0.9 mW / m2像素。还显示出可以以高于350 MHz的速率切换像素。

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